RLV12 Building Instructions

Adjusting the PCB

I ordered the PCB without chamfered edge for the PCB connector so you have to do it yourself. Use a large fine file and make sure that you do not file the contacts but just the edge.

Often I have found that the edge connectors are slightly too wide. It is very difficult to insert and remove the card. Therefore you need to file the four sides a little bit until it inserts and removes without effort. I assume it is also better for the Q-Bus slots.

Chamfer and File PCB

BOM

Name Value Package Description
C1 10uF SMC C Decoupling Capacitor
C2 10uF SMC C Decoupling Capacitor
C3 10uF SMC C Decoupling Capacitor
C4 10uF SMC C Decoupling Capacitor
C5 10uF SMC C Decoupling Capacitor
C6 100nF-330nF SMD 0805 Decoupling Capacitor
C7 10uF SMC C Decoupling Capacitor
C8 100nF-330nF SMD 0805 Decoupling Capacitor
C9 10uF SMC C Decoupling Capacitor
C10 100nF-330nF SMD 0805 Decoupling Capacitor
C11 100nF-330nF SMD 0805 Decoupling Capacitor
C12 100nF-330nF SMD 0805 Decoupling Capacitor
C13 22pF SMD 0805 XTAL Load Capacitor
C14 22pF SMD 0805 XTAL Load Capacitor
C15 10uF SMC C Decoupling Capacitor
C16 100nF-330nF SMD 0805 Decoupling Capacitor
C17 100nF-330nF SMD 0805 Decoupling Capacitor
C18 100nF-330nF SMD 0805 Decoupling Capacitor
C19 100nF-330nF SMD 0805 Decoupling Capacitor
C20 10uF SMC C Decoupling Capacitor
C21 100nF-330nF SMD 0805 Decoupling Capacitor
C22 100nF-330nF SMD 0805 Decoupling Capacitor
C23 100nF-330nF SMD 0805 Decoupling Capacitor
C24 100nF-330nF SMD 0805 Decoupling Capacitor
C25 100nF-330nF SMD 0805 Decoupling Capacitor
C26 100nF-330nF SMD 0805 Decoupling Capacitor
C27 47-220uF SMC C Decoupling Capacitor
       
       
       
IC1 ATF1508AS-10AU100 TQFP-100 128 Macrocell CPLD 5V standard power
IC2 DC005N DIP-20 Quad Universal Unified Bus Transceiver
IC3 DC005N DIP-20 Quad Universal Unified Bus Transceiver
IC4 DC005N DIP-20 Quad Universal Unified Bus Transceiver
IC5 DC005N DIP-20 Quad Universal Unified Bus Transceiver
IC6 74HC4050 SOIC-16 Hex Buffer used as SD-Card Level Shifter
IC7 REG1117 SOT223 3V3 LDO Voltage Regulator
IC8 ATMEGA1284P-20PU DIL-40 Atmel/Microchip 8-bit MCU
       
X1 22.1184MHz HC49 22.1184MHz Crystal
X2 2x3-Pin Shrouded Header   AVR ISP for MCU
X3 2x5-Pin Shrouded Header   CPLD JTAG
X4      
       
E1 74S38D SOIC-14 Quad Dual-NAND with high current O.C. output
E2 74S38D SOIC-14 Quad Dual-NAND with high current O.C. output
E3 74S38D SOIC-14 Quad Dual-NAND with high current O.C. output
E4 74S38D SOIC-14 Quad Dual-NAND with high current O.C. output
E5 DS8837M SOIC-16 Hex Unified Bus Receiver
E6 DS8837M SOIC-16 Hex Unified Bus Receiver
       
R1 2k2 SMD 0805 Pull-Up resistor for MISO (SD-Card Data Out)
R2 0Ohm SMD 0805 Optional to source power via USB Serial Adapter
R3 330Ohm SMD 0805 Termination Resistor
R4 680Ohm SMD 0805 Termination Resistor
R5 330Ohm SMD 0805 Termination Resistor
R6 680Ohm SMD 0805 Termination Resistor
R7 2k2 SMD 0805 SD-Card Pull-Up (not really required)
R8 2k2 SMD 0805 SD-Card Pull-Up (not really required)
       
U$2 YAMAICHI-FPS-009-2405-0 SDMMC SD-Card Slot Push-Push
       
JP6 4-Pin single row header   MCU UART interface
       
Socket   DIL-16 Socket for IC2 (optional)
Socket   DIL-16 Socket for IC3 (optional)
Socket   DIL-16 Socket for IC4 (optional)
Socket   DIL-16 Socket for IC5 (optional)
Socket   DIL-40 Socket for IC8 (optional)

Assembly

As always with SMD soldering you must start with the flattest parts. I typically start with the TQFP-100 packages. Next are the SMD 0805 sized capacitors and resistors followed by the SD-Card cage. The SD-Card cage has two solder points at the entry side which you must solder to the ground. Be careful to not overheat the card cage in order to not destroy the inlaid plastic.

Next are all other SMD parts like the Tantalum capacitors and the rest of the SOIC packages. Finally you can mount all through hole parts and sockets.

You should carefully inspect all soldering points, especially the TQFP-100 package. Make sure that there are no solder bridges and that all pins are perfectly soldered to the pads and have contact. The later is more of a problem to me than the first. I use small pins to test every pad.

Initial Setup

Power Check

For DIL packages I normally use sockets and I install the necessary software and design files before adding the DIL parts. Here is a picture of a fully assembled emulator without the four DC005 ICs.

Finished RLV12 Emulator

Before you insert the emulator you need to program the CPDL and the processor. You can get the files in the download section. Use an external 5V power source. Check first that the power consumption is within reasonable limits. As next you can hook up the CPLD programmer and load the JEDEC file and then you program the microcontroller using the HEX file.